Advanced Packaging Associates

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Territory

Specialists in precision laser machining and drilling of difficult applications.
California (except San Diego County)

Over 30 years of experience in multilayer ceramics: Alumina (HTCC), Aluminum Nitride, BeO and LTCC
Arizona, California, Oregon, Washington

MatriX Materials

Custom forumlated, Pre-Applied Adhesives and Sealants on ceramic, plastic lids, packages.

Arizona, California, Idaho, Oregon, Washington

REMTEC

Combining Plated Copper Metallization with multiplayer Thick Films for Custom Metallized Ceramic Substrates, Chip Carriers, Hermetic Packages and Submounts. Substrate materials include Alumina, Aluminum Nitride (AlN), Beryllium Oxide (BeO), Quartz, high dielectric constant materials.

NEW: Direct Bond Copper - Quick-turn, low to medium volume custom Alumina, Aluminum Nitride substrates using Curamik® Master Cards
Arizona, California

Custom lightweight thermal management solutions, based on a family of Spray Formed Controlled Expansion (“CE”) aluminum alloys. Arizona, California, Idaho, Oregon, Washington

Manufacturer of high reliability metal hermetic packages and windows for RF/Microwave, Fiber Optic, Detector, Power and Hybrid applications. Custom designs or choose from our thousands of standard tools. Wide range of housing materials, including Aluminum, Fe-Ni alloys including Invar® and Kovar®, and Steel.
Arizona, Southern California, Oregon, Washington

Bonding Capillaries; Die, Wire, Wedge Bonding Tools Idaho, Oregon, Washington

APA also maintains relationships with several sources of high value solutions for:

ORGANIC SUBSTRATES - click here for further details

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Click on logos below for more information		Territory
	Specialists in precision laser machining and drilling of difficult applications.	California (except San Diego County)
	Over 30 years of experience in multilayer ceramics: Alumina (HTCC), Aluminum Nitride, BeO and LTCC	Arizona, California, Oregon, Washington
MatriX Materials	Custom forumlated, Pre-Applied Adhesives and Sealants on ceramic, plastic lids, packages.	Arizona, California, Idaho, Oregon, Washington
REMTEC	Combining Plated Copper Metallization with multiplayer Thick Films for Custom Metallized Ceramic Substrates, Chip Carriers, Hermetic Packages and Submounts. Substrate materials include Alumina, Aluminum Nitride (AlN), Beryllium Oxide (BeO), Quartz, high dielectric constant materials. NEW: Direct Bond Copper - Quick-turn, low to medium volume custom Alumina, Aluminum Nitride substrates using Curamik® Master Cards	Arizona, California
	Custom lightweight thermal management solutions, based on a family of Spray Formed Controlled Expansion (“CE”) aluminum alloys.	Arizona, California, Idaho, Oregon, Washington
	Manufacturer of high reliability metal hermetic packages and windows for RF/Microwave, Fiber Optic, Detector, Power and Hybrid applications. Custom designs or choose from our thousands of standard tools. Wide range of housing materials, including Aluminum, Fe-Ni alloys including Invar® and Kovar®, and Steel.	Arizona, Southern California, Oregon, Washington
	Bonding Capillaries; Die, Wire, Wedge Bonding Tools	Idaho, Oregon, Washington